- 专利标题： Package structure and method for manufacturing the same
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申请号： US16817407申请日： 2020-03-12
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公开(公告)号： US11244909B2公开(公告)日： 2022-02-08
- 发明人: Fan-Yu Min , Chen-Hung Lee , Wei-Hang Tai , Yuan-Tzuo Luo , Wen-Yuan Chuang , Chun-Cheng Kuo , Chin-Li Kao
- 申请人： Advanced Semiconductor Engineering, Inc.
- 申请人地址： TW Kaohsiung
- 专利权人： Advanced Semiconductor Engineering, Inc.
- 当前专利权人： Advanced Semiconductor Engineering, Inc.
- 当前专利权人地址： TW Kaohsiung
- 代理机构： Foley & Lardner LLP
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L23/16 ; H01L23/31 ; H01L23/538 ; H01L21/48 ; H01L21/56
摘要：
A package structure and a manufacturing method are provided. The package structure includes a wiring structure, a first electronic device and a second electronic device. The first electronic device is disposed on the wiring structure. The second electronic device is disposed on the wiring structure. The first electronic device and the second electronic device are disposed side by side. A gap between the first electronic device and the second electronic device is greater than or equal to about 150 μm.
公开/授权文献
- US20210287999A1 PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME 公开/授权日：2021-09-16
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