Invention Grant
- Patent Title: Methods of forming devices on a substrate
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Application No.: US16706113Application Date: 2019-12-06
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Publication No.: US11193198B2Publication Date: 2021-12-07
- Inventor: Joseph C. Olson , Ludovic Godet , Rutger Meyer Timmerman Thijssen , Morgan Evans , Jinxin Fu
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: G03F7/20
- IPC: G03F7/20 ; C23C14/22 ; G02B5/18 ; G03F7/00 ; G03F7/16 ; F21V8/00

Abstract:
Embodiments of the disclosure relate to systems and methods for forming devices on a substrate. For example, a method for forming devices on a substrate can include projecting one or more ion beams from one or more ion beam chambers to form one or more devices on a first surface of a substrate and projecting one or more ion beams from one or more ion beam chambers to form one or more devices on a second surface of a substrate. In these embodiments, the first surface and the second surface are on opposite sides of the substrate. Therefore, the ion beams can form the devices on both sides of the substrate.
Information query
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