- 专利标题: Electromagnetic interference shielding for packages and modules
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申请号: US17010676申请日: 2020-09-02
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公开(公告)号: US11177223B1公开(公告)日: 2021-11-16
- 发明人: Aniket Patil , Hong Bok We , Brigham Navaja
- 申请人: QUALCOMM Incorporated
- 申请人地址: US CA San Diego
- 专利权人: QUALCOMM Incorporated
- 当前专利权人: QUALCOMM Incorporated
- 当前专利权人地址: US CA San Diego
- 代理机构: Muncy, Geissler, Olds & Lowe, P.C.
- 主分类号: H05K1/02
- IPC分类号: H05K1/02 ; H01L23/552 ; H05K1/09 ; H05K1/11
摘要:
Disclosed is an apparatus and methods for making same. The apparatus includes a substrate, a set of electrical contacts disposed on the surface of the substrate, and an electromagnetic interference (EMI) shield pedestal structure, disposed between an outer periphery of the set of electrical contacts and an outer portion of the substrate.
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