- 专利标题： Wafer reconstitution and die-stitching
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申请号： US16503806申请日： 2019-07-05
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公开(公告)号： US11158607B2公开(公告)日： 2021-10-26
- 发明人: Sanjay Dabral , Jun Zhai , Kwan-Yu Lai , Kunzhong Hu , Vidhya Ramachandran
- 申请人： Apple Inc.
- 申请人地址： US CA Cupertino
- 专利权人： Apple Inc.
- 当前专利权人： Apple Inc.
- 当前专利权人地址： US CA Cupertino
- 代理机构： Aikin & Gallant, LLP
- 主分类号： H01L25/065
- IPC分类号： H01L25/065 ; H01L21/56 ; H01L21/768 ; H01L21/78 ; H01L21/66 ; H01L23/48 ; H01L23/60 ; H01L23/00 ; H01L25/00
摘要：
Stitched die packaging techniques and structures are described in which reconstituted chips are formed using wafer reconstitution and die-stitching techniques. In an embodiment, a chip includes a reconstituted chip-level back end of the line (BEOL) build-up structure to connect a die set embedded in an inorganic gap fill material.
公开/授权文献
- US20200176419A1 WAFER RECONSTITUTION AND DIE-STITCHING 公开/授权日：2020-06-04
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