- 专利标题: Mask blank, phase shift mask and method for manufacturing semiconductor device
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申请号: US15760265申请日: 2016-09-08
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公开(公告)号: US11119399B2公开(公告)日: 2021-09-14
- 发明人: Atsushi Matsumoto , Hiroaki Shishido , Takashi Uchida
- 申请人: HOYA CORPORATION
- 申请人地址: JP Tokyo
- 专利权人: HOYA CORPORATION
- 当前专利权人: HOYA CORPORATION
- 当前专利权人地址: JP Tokyo
- 代理机构: Kilpatrick Townsend & Stockton LLP
- 优先权: JPJP2015-185779 20150918
- 国际申请: PCT/JP2016/076402 WO 20160908
- 国际公布: WO2017/047490 WO 20170323
- 主分类号: G03F1/32
- IPC分类号: G03F1/32 ; G03F1/58 ; G03F1/38 ; G03F1/48 ; G03F1/20 ; G03F1/42 ; G03F1/80 ; H01L21/033
摘要:
According to the present invention, provided is a mask blank (10), in which: a light shielding film (4) has a single layer structure or a laminate structure of a plurality of layers; at least one layer of the light shielding film (4) is formed of a material which contains a transition metal and silicon and is free from nitrogen and oxygen, or a material which contains a transition metal, silicon, and nitrogen and satisfies a condition of the following expression (1); a phase shift film (2) has a surface layer and a layer other than the surface layer; and the layer other than the surface layer is formed of a material which contains a transition metal, silicon, nitrogen, and oxygen, has a content of oxygen of 3 atom % or more, and satisfies a condition of the following expression (A). CN≤9.0×10−6×RM4−1.65×10−4×RM3−7.718×10−2×RM2+3.611×RM−21.084 Expression (1) 0.04×AS−0.06×AM>1 Expression (A)
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