Invention Grant
- Patent Title: Fan-out package having a main die and a dummy die
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Application No.: US16705308Application Date: 2019-12-06
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Publication No.: US11094641B2Publication Date: 2021-08-17
- Inventor: Yan-Fu Lin , Chen-Hua Yu , Meng-Tsan Lee , Wei-Cheng Wu , Hsien-Wei Chen
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L23/00 ; H01L23/528 ; H01L25/10 ; H01L23/31 ; H01L21/48
Abstract:
A Fan-Out package having a main die and a dummy die side-by-side is provided. A molding material is formed along sidewalls of the main die and the dummy die, and a redistribution layer having a plurality of vias and conductive lines is positioned over the main die and the dummy die, where the plurality of vias and the conductive lines are electrically connected to connectors of the main die.
Information query
IPC分类:
