Invention Grant
- Patent Title: Defect inspection method and apparatus using micro lens matrix
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Application No.: US16523859Application Date: 2019-07-26
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Publication No.: US11085884B2Publication Date: 2021-08-10
- Inventor: Qiang Wu , Wei Xiong , Xuan Li
- Applicant: Semiconductor Manufacturing International (Shanghai) Corporation , Semiconductor Manufacturing International (Beijing) Corporation
- Applicant Address: CN Shanghai; CN Beijing
- Assignee: Semiconductor Manufacturing International (Shanghai) Corporation,Semiconductor Manufacturing International (Beijing) Corporation
- Current Assignee: Semiconductor Manufacturing International (Shanghai) Corporation,Semiconductor Manufacturing International (Beijing) Corporation
- Current Assignee Address: CN Shanghai; CN Beijing
- Agency: Anova Law Group, PLLC
- Priority: CN201610826112.1 20160918
- Main IPC: G01N21/95
- IPC: G01N21/95 ; G02B3/00 ; G06T5/00 ; G06T7/00 ; G01N21/88 ; G01N21/956 ; H01L21/66

Abstract:
A substrate surface defect detection device includes an optical waveguide for receiving first light and directing the received first light to a surface of a to be tested substrate, the optical waveguide having a first surface facing toward the substrate and a second surface facing away from the substrate, a microlens array disposed on the second surface of the optical waveguide, the microlens array including a plurality of microlenses arranged in an array for receiving second light from the surface of the to be tested substrate and converging the received second light to converged light, and an imaging component for receiving the converged light from the at least one microlens array for optical imaging. The substrate surface defect detection device requires significantly less time than conventional substrate surface defect detection devices.
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