- 专利标题: Thermally conductive insert element for electronic unit
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申请号: US16747097申请日: 2020-01-20
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公开(公告)号: US11076503B2公开(公告)日: 2021-07-27
- 发明人: Jakub Korta , Marcel Fruend , Klaus Kaufmann
- 申请人: APTIV TECHNOLOGIES LIMITED
- 申请人地址: BB St. Michael
- 专利权人: APTIV TECHNOLOGIES LIMITED
- 当前专利权人: APTIV TECHNOLOGIES LIMITED
- 当前专利权人地址: BB St. Michael
- 代理机构: Carlson, Gaskey & Olds
- 优先权: EP19152913 20190121
- 主分类号: H05K7/20
- IPC分类号: H05K7/20 ; H01L23/473 ; H01L23/367 ; H05K5/06 ; H01L23/433
摘要:
Electronic unit comprises an housing comprising a top cover; a printed circuit board mounted inside the housing and comprising at least a first heating source element on the top layer of the printed circuit board; the top cover comprises at least a first opening; the electronic unit comprises at least a first thermally conductive insert element distinct from the housing and extending from its top extremity arranged around the first opening, to its bottom extremity in thermal contact with the first heating source element such that heating dissipation of the first heating source element is allowed; fixing means configured to entirely fix the top extremity of the first thermally conductive insert element with the top cover around the first opening.
公开/授权文献
- US20200236811A1 THERMALLY CONDUCTIVE INSERT ELEMENT FOR ELECTRONIC UNIT 公开/授权日:2020-07-23
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