- 专利标题: System and method of post-cure processing of composite core
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申请号: US16740977申请日: 2020-01-13
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公开(公告)号: US11065775B2公开(公告)日: 2021-07-20
- 发明人: Phillip A. Kendrick , Levi H. Armstrong
- 申请人: Bell Textron Inc.
- 申请人地址: US TX Fort Worth
- 专利权人: Bell Textron Inc.
- 当前专利权人: Bell Textron Inc.
- 当前专利权人地址: US TX Fort Worth
- 代理机构: Timmer Law Group, PLLC
- 主分类号: B26D1/00
- IPC分类号: B26D1/00 ; B29D99/00 ; B29C53/00 ; B29C70/00 ; B26D7/00 ; B26D1/157 ; B29C53/60 ; B29C70/54 ; B26D7/01 ; B29C69/00 ; B26D1/10 ; B26D3/16 ; B26D1/08 ; B29C65/00 ; B32B3/12 ; B32B37/14 ; B29C70/30
摘要:
A method of cutting a wafer of composite core from a bulk composite core including the steps of placing the bulk composite core in a container, the bulk composite core having a plurality of tube members; depositing a potting compound in contact with an outer surface of the bulk composite core; curing the potting compound; and after curing of the potting compound, cutting through each of the tube members. A method of cutting a wafer of composite core from a bulk composite core, the method comprising the steps of stabilizing the bulk composite core by wrapping an exterior of the bulk composite core with a composite wrap, the bulk composite core having a plurality of tube members; curing the composite wrap; and cutting through each of the tube members.
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