- 专利标题: Silicon substrate modification to enable formation of thin, relaxed, germanium-based layer
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申请号: US16611920申请日: 2017-06-30
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公开(公告)号: US11056592B2公开(公告)日: 2021-07-06
- 发明人: Karthik Jambunathan , Cory C. Bomberger , Glenn A. Glass , Anand S. Murthy , Ju H. Nam , Tahir Ghani
- 申请人: INTEL CORPORATION
- 申请人地址: US CA Santa Clara
- 专利权人: INTEL CORPORATION
- 当前专利权人: INTEL CORPORATION
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Schwabe, Williamson & Wyatt, P.C.
- 国际申请: PCT/US2017/040320 WO 20170630
- 国际公布: WO2019/005112 WO 20190103
- 主分类号: H01L29/78
- IPC分类号: H01L29/78 ; H01L27/092
摘要:
An integrated circuit (IC) includes a substrate that includes silicon. A first layer is on the substrate and includes a first monocrystalline semiconductor material, the first layer having a plurality of defects. A second layer is on the first layer and includes a second monocrystalline semiconductor material that includes germanium. A strained channel structure is above the first layer. A gate structure is at least above the channel structure. A source region is adjacent the channel structure. A drain region is adjacent the channel structure, such that the channel structure is laterally between the source region and the drain region.
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