- 专利标题: Packages with metal line crack prevention design
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申请号: US15914102申请日: 2018-03-07
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公开(公告)号: US11056464B2公开(公告)日: 2021-07-06
- 发明人: Chen-Hua Yu , Shin-Puu Jeng , Der-Chyang Yeh , Hsien-Wei Chen , Jie Chen
- 申请人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址: TW Hsinchu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Slater Matsil, LLP
- 主分类号: H01L21/768
- IPC分类号: H01L21/768 ; H01L25/065 ; H01L23/538 ; H01L23/00 ; H01L25/10 ; H01L23/50 ; H01L23/48 ; H01L23/31
摘要:
A package includes a corner, a device die, a plurality of redistribution lines underlying the device die, and a plurality of metal pads electrically coupled to the plurality of redistribution lines. The plurality of metal pads includes a corner metal pad closest to the corner, wherein the corner metal pad is a center-facing pad having a bird-beak direction substantially pointing to a center of the package. The plurality of metal pads further includes a metal pad farther away from the corner than the corner metal pad, wherein the metal pad is a non-center-facing pad having a bird-beak direction pointing away from the center of the package.
公开/授权文献
- US20180197839A1 Packages with Metal Line Crack Prevention Design 公开/授权日:2018-07-12
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