- 专利标题： Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layer
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申请号： US16572626申请日： 2019-09-17
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公开(公告)号： US10978418B2公开(公告)日： 2021-04-13
- 发明人: Joachim Mahler , Michael Bauer , Jochen Dangelmaier , Reimund Engl , Johann Gatterbauer , Frank Hille , Michael Huettinger , Werner Kanert , Heinrich Koerner , Brigitte Ruehle , Francisco Javier Santos Rodriguez , Antonio Vellei
- 申请人： Infineon Technologies AG
- 申请人地址： DE Neubiberg
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Neubiberg
- 代理机构： Viering, Jentschura & Partner mbB
- 优先权： DE102016109349.1 20160520
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L23/31 ; H01L23/29 ; H01L21/02 ; H01L23/495
摘要：
A method of forming an electrical contact and a method of forming a chip package are provided. The methods may include arranging a metal contact structure including a non-noble metal and electrically contacting the chip, arranging a packaging material, and a protective layer including or essentially consisting of a portion formed at an interface between a portion of the metal contact structure and the packaging material, wherein the protective layer may include a noble metal, wherein the portion of the protective layer may include a plurality of regions free from the noble metal, and wherein the regions free from the noble metal may provide an interface between the packaging material and the non-noble metal of the metal contact structure.
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