- 专利标题: High voltage semiconductor device and method of fabrication
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申请号: US16124444申请日: 2018-09-07
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公开(公告)号: US10886399B2公开(公告)日: 2021-01-05
- 发明人: Philippe Renaud
- 申请人: NXP USA, Inc.
- 申请人地址: US TX Austin
- 专利权人: NXP USA, Inc.
- 当前专利权人: NXP USA, Inc.
- 当前专利权人地址: US TX Austin
- 代理商 Charlene Jacobsen
- 主分类号: H01L29/78
- IPC分类号: H01L29/78 ; H01L29/40 ; H01L29/08
摘要:
A semiconductor device, such as a laterally diffused metal-oxide-semiconductor (LDMOS) transistor, includes a semiconductor substrate in which a source region and a drain region are disposed. The drain region has a drain finger terminating at a drain end. A gate structure is supported by the semiconductor substrate between the source region and the drain region, the gate structure extending laterally beyond the drain end. A drift region in the semiconductor substrate extends laterally from the drain region to at least the gate structure. The drift region is characterized by a first distance between a first sidewall of the drain finger and a second sidewall of the gate structure, and the gate structure is laterally tilted away from the drain region at the drain end of the drain finger to a second distance that is greater than the first distance.
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