• 专利标题: High voltage semiconductor device and method of fabrication
  • 申请号: US16124444
    申请日: 2018-09-07
  • 公开(公告)号: US10886399B2
    公开(公告)日: 2021-01-05
  • 发明人: Philippe Renaud
  • 申请人: NXP USA, Inc.
  • 申请人地址: US TX Austin
  • 专利权人: NXP USA, Inc.
  • 当前专利权人: NXP USA, Inc.
  • 当前专利权人地址: US TX Austin
  • 代理商 Charlene Jacobsen
  • 主分类号: H01L29/78
  • IPC分类号: H01L29/78 H01L29/40 H01L29/08
High voltage semiconductor device and method of fabrication
摘要:
A semiconductor device, such as a laterally diffused metal-oxide-semiconductor (LDMOS) transistor, includes a semiconductor substrate in which a source region and a drain region are disposed. The drain region has a drain finger terminating at a drain end. A gate structure is supported by the semiconductor substrate between the source region and the drain region, the gate structure extending laterally beyond the drain end. A drift region in the semiconductor substrate extends laterally from the drain region to at least the gate structure. The drift region is characterized by a first distance between a first sidewall of the drain finger and a second sidewall of the gate structure, and the gate structure is laterally tilted away from the drain region at the drain end of the drain finger to a second distance that is greater than the first distance.
信息查询
IPC分类:
H 电学
H01 基本电气元件
H01L 半导体器件;其他类目中不包括的电固体器件(使用半导体器件的测量入G01;一般电阻器入H01C;磁体、电感器、变压器入H01F;一般电容器入H01G;电解型器件入H01G9/00;电池组、蓄电池入H01M;波导管、谐振器或波导型线路入H01P;线路连接器、汇流器入H01R;受激发射器件入H01S;机电谐振器入H03H;扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R;一般电光源入H05B;印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K;在具有特殊应用的电路中使用的半导体器件见应用相关的小类)
H01L29/00 专门适用于整流、放大、振荡或切换,并具有至少一个电位跃变势垒或表面势垒的半导体器件;具有至少一个电位跃变势垒或表面势垒,例如PN结耗尽层或载流子集结层的电容器或电阻器;半导体本体或其电极的零部件(H01L31/00至H01L47/00,H01L51/05优先;除半导体或其电极之外的零部件入H01L23/00;由在一个共用衬底内或其上形成的多个固态组件组成的器件入H01L27/00)
H01L29/66 .按半导体器件的类型区分的
H01L29/68 ..只能通过对一个不通有待整流、放大或切换的电流的电极供给电流或施加电位方可进行控制的(H01L29/96优先)
H01L29/76 ...单极器件
H01L29/772 ....场效应晶体管
H01L29/78 .....由绝缘栅产生场效应的
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