- 专利标题： Linear image sensor and method for manufacturing same
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申请号： US16322558申请日： 2017-07-25
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公开(公告)号： US10886316B2公开(公告)日： 2021-01-05
- 发明人: Norihiro Muramatsu , Katsunori Nozawa
- 申请人： HAMAMATSU PHOTONICS K.K.
- 申请人地址： JP Hamamatsu
- 专利权人： HAMAMATSU PHOTONICS K.K.
- 当前专利权人： HAMAMATSU PHOTONICS K.K.
- 当前专利权人地址： JP Hamamatsu
- 代理机构： Faegre Drinker Biddle & Reath LLP
- 优先权： JP2016-158527 20160812
- 国际申请： PCT/JP2017/026892 WO 20170725
- 国际公布： WO2018/030147 WO 20180215
- 主分类号： H01L27/14
- IPC分类号： H01L27/14 ; H01L27/146 ; H01L23/28 ; H04N1/028 ; H01L25/04
摘要：
A linear image sensor includes first and second sensor chips, first and second substrates, a common support substrate, a support portion, a dam portion, and a sealing portion. The first sensor chip is mounted to partially protrude on one end side of the first substrate. The second sensor chip is mounted to partially protrude on one end side of the second substrate. The first and second substrates are mounted on the common support substrate. The support portion is provided in a gap between the end faces of the first and second substrates. The dam portion is provided annularly to surround the sensor chips. The sealing portion seals the sensor chips, in a region surrounded by the dam portion.
公开/授权文献
- US10854650B2 Linear image sensor and method for manufacturing same 公开/授权日：2020-12-01
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