- 专利标题: Peeling method of flexible substrate
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申请号: US15574068申请日: 2017-04-10
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公开(公告)号: US10882221B2公开(公告)日: 2021-01-05
- 发明人: Ming Che Hsieh , Chunyan Xie , Lu Liu , Hejin Wang , Yuanzheng Guo
- 申请人: BOE Technology Group Co., Ltd.
- 申请人地址: CN Beijing
- 专利权人: BOE Technology Group Co., Ltd.
- 当前专利权人: BOE Technology Group Co., Ltd.
- 当前专利权人地址: CN Beijing
- 代理机构: Westman, Champlin & Koehler, P.A.
- 优先权: CN201610244839 20160418
- 国际申请: PCT/CN2017/079893 WO 20170410
- 国际公布: WO2017/181860 WO 20171026
- 主分类号: B29C35/08
- IPC分类号: B29C35/08 ; B32B7/12 ; H01L21/683 ; B29C41/02 ; B29L31/34
摘要:
This disclosure relates to a peeling method of a flexible substrate, and belongs to the technical field of flexible display. The method comprises the steps of: (a) forming a flexible substrate on a base substrate, wherein the flexible substrate has a plane area less than that of the base substrate; (b) adhering a protective film on the base substrate formed with the flexible substrate by an ultraviolet viscosity-reducing adhesive, wherein the plane area of the flexible substrate is less than that of the protective film, and the protective film is further adhered to the base substrate by the ultraviolet viscosity-reducing adhesive; (c) irradiating a region on the base substrate covered by the protective film through the base substrate with an ultraviolet light; and (d) peeling the protective film and the flexible substrate from the base substrate after the irradiation with an ultraviolet light is completed.
公开/授权文献
- US20180290344A1 PEELING METHOD OF FLEXIBLE SUBSTRATE 公开/授权日:2018-10-11
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