Invention Grant
- Patent Title: Light emitting structure
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Application No.: US16688646Application Date: 2019-11-19
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Publication No.: US10833058B2Publication Date: 2020-11-10
- Inventor: John A. Higginson , Andreas Bibl , Hsin-Hua Hu
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Jaffery Watson Mendonsa & Hamilton LLP
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L25/16 ; H01L33/44 ; H01L33/06 ; H01L33/00 ; H01L33/42 ; H01L33/62 ; H01L25/075 ; H01L27/12 ; H01L25/00 ; H01L33/54 ; H01L21/56
Abstract:
A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
Public/Granted literature
- US20200091127A1 LIGHT EMITTING STRUCTURE Public/Granted day:2020-03-19
Information query
IPC分类:
