- 专利标题: Semiconductor device and method for manufacturing semiconductor device
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申请号: US15292243申请日: 2016-10-13
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公开(公告)号: US10811521B2公开(公告)日: 2020-10-20
- 发明人: Shunpei Yamazaki , Kenichi Okazaki , Junichi Koezuka , Toshinari Sasaki
- 申请人: Semiconductor Energy Laboratory Co., Ltd.
- 申请人地址: JP Atsugi-shi, Kanagawa-ken
- 专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人地址: JP Atsugi-shi, Kanagawa-ken
- 代理机构: Fish & Richardson P.C.
- 优先权: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@568531b0
- 主分类号: H01L29/78
- IPC分类号: H01L29/78 ; H01L29/66 ; H01L29/786 ; H01L21/02 ; H01L21/441
摘要:
In a top-gate transistor in which an oxide semiconductor film, a gate insulating film, a gate electrode layer, and a silicon nitride film are stacked in this order and the oxide semiconductor film includes a channel formation region, nitrogen is added to regions of part of the oxide semiconductor film and the regions become low-resistance regions by forming a silicon nitride film over and in contact with the oxide semiconductor film. A source and drain electrode layers are in contact with the low-resistance regions. A region of the oxide semiconductor film, which does not contact the silicon nitride film (that is, a region overlapping with the gate insulating film and the gate electrode layer) becomes the channel formation region.
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