- 专利标题： Circuit support and cooling structure
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申请号： US15948404申请日： 2018-04-09
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公开(公告)号： US10785863B2公开(公告)日： 2020-09-22
- 发明人: Susan C. Trulli , Christopher M. Laighton
- 申请人： Raytheon Company
- 申请人地址： US MA Waltham
- 专利权人： Raytheon Company
- 当前专利权人： Raytheon Company
- 当前专利权人地址： US MA Waltham
- 代理机构： Daly, Crowley, Mofford & Durkee, LLP
- 主分类号： H05K1/02
- IPC分类号： H05K1/02 ; H05K1/18 ; H01L23/66 ; H01L23/367 ; H01L25/065 ; H01L25/00 ; H05K3/12 ; H01L23/538 ; H01L21/48 ; H03F3/195 ; H03F3/21 ; H03F3/213 ; H01L25/16 ; H01L21/56 ; H05K3/34 ; H01L25/18 ; H03F1/30 ; H01L23/373 ; H01P3/08 ; H01P11/00 ; H01L23/42
摘要：
A MMIC support and cooling structure having a three-dimensional, thermally conductive support structure having a plurality of surfaces and a circuit having a plurality of heat generating electrical components disposed on a first portion of the surfaces and interconnected by microwave transmission lines disposed on a second portion of the plurality of surfaces of the thermally conductive support structure.
公开/授权文献
- US20190313522A1 CIRCUIT SUPPORT AND COOLING STRUCTURE 公开/授权日：2019-10-10
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