An IC device carrier includes organic substrate layers and wiring line layers therein. To reduce stain of the organic substrate layers and to provide decoupling capacitance, one or more decoupling capacitor stiffeners (DCS) are applied to the top side metallization (TSM) surface of the IC device carrier. The DCS(s) reduce the amount of curvature of the IC device carrier and reduce the strain seen by the organic substrate layers, thereby mitigating the risk for cracks forming and expanding or other damage within the carrier. The DCS(s) also include two or more capacitor plates and provides capacitance to electrically decouple electrical subsystems of the system of which the DCS is apart.