- 专利标题： Semiconductor device and manufacturing method, and electronic appliance
-
申请号： US16242764申请日： 2019-01-08
-
公开(公告)号： US10707259B2公开(公告)日： 2020-07-07
- 发明人: Jun Ogi , Junichiro Fujimagari , Susumu Inoue , Atsushi Fujiwara
- 申请人： SONY CORPORATION
- 申请人地址： JP Tokyo
- 专利权人： Sony Corporation
- 当前专利权人： Sony Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Sheridan Ross P.C.
- 优先权： com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@619bb84f
- 主分类号： H01L27/146
- IPC分类号： H01L27/146 ; H01L23/00
摘要：
There is provided a semiconductor device including: a plurality of bumps on a first semiconductor substrate; and a lens material in a region other than the plurality of bumps on the first semiconductor substrate, wherein a distance between a side of a bump closest to the lens material and a side of the lens material closest to the bump is greater than twice a diameter of the bump closest to the lens material, and wherein the distance between the side of the bump closest to the lens material and the side of the lens material closest to the bump is greater a minimum pitch of the bumps.
公开/授权文献
信息查询
IPC分类:
