• 专利标题: Solid state imaging device, manufacturing method of the same, and electronic equipment
  • 申请号: US15722960
    申请日: 2017-10-02
  • 公开(公告)号: US10680022B2
    公开(公告)日: 2020-06-09
  • 发明人: Hiroshi TayanakaYuuji InoueMasashi Nakata
  • 申请人: SONY CORPORATION
  • 申请人地址: JP Tokyo
  • 专利权人: Sony Corporation
  • 当前专利权人: Sony Corporation
  • 当前专利权人地址: JP Tokyo
  • 代理机构: Sheridan Ross P.C.
  • 优先权: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@ecc7375 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@68ad856
  • 主分类号: H01L27/146
  • IPC分类号: H01L27/146
Solid state imaging device, manufacturing method of the same, and electronic equipment
摘要:
A solid state imaging device that includes a phase difference detection pixel which is a pixel for phase difference detection; a first imaging pixel which is a pixel for imaging and is adjacent to the phase difference detection pixel; and a second imaging pixel which is a pixel for imaging other than the first imaging pixel. An area of a color filter of the first imaging pixel is smaller than an area of a color filter of the second imaging pixel.
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