发明授权
- 专利标题: Multi-direction connectable electronic module and modular electronic building system
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申请号: US16021990申请日: 2018-06-28
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公开(公告)号: US10585846B2公开(公告)日: 2020-03-10
- 发明人: Zhenshan Wang , Kejia Pan , Bin Feng , Xi Li
- 申请人: Microduino Inc. , Meike Technology (Beijing) Ltd.
- 申请人地址: US CA Westlake Village CN Beijing
- 专利权人: MICRODUINO INC.,MEIKE TECHNOLOGY (BEIJING) LTD.
- 当前专利权人: MICRODUINO INC.,MEIKE TECHNOLOGY (BEIJING) LTD.
- 当前专利权人地址: US CA Westlake Village CN Beijing
- 代理机构: Anova Law Group, PLLC
- 优先权: CN201710518802 20170630
- 主分类号: G06F15/78
- IPC分类号: G06F15/78 ; A63H33/04 ; A63H33/26 ; G06F1/16 ; H03M1/66 ; H03M1/12
摘要:
A multi-direction connectable electronic module includes a circuit board, including a top surface, a bottom surface, and at least one side; and a plurality of connectors connected to the circuit board, each including a lateral magnetic connector, a shell, a longitudinal inter-locking part, and a lateral inter-locking part. The lateral inter-locking part is configured to connect with a first electronic building block along the lateral direction. The longitudinal inter-locking part is configured to stack with a second electronic building block along the longitudinal direction. The lateral magnetic connector is configured to magnetically connect with the first electronic building block. A plurality of through holes are formed on the shell. A lateral pin connector disposed on the at least one side of the circuit board includes a plurality of pins located at positions corresponding to the plurality of through holes, and is configured to electrically connect the first electronic building block.
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