Invention Grant
- Patent Title: Semiconductor devices having contact plugs overlapping associated bitline structures and contact holes
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Application No.: US16553840Application Date: 2019-08-28
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Publication No.: US10573653B2Publication Date: 2020-02-25
- Inventor: Jun-Kyum Kim , Jung-Woo Seo , Sung-Un Kwon
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee IP Law, P.C.
- Priority: KR10-2014-0109042 20140821
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L27/108 ; H01L21/768
Abstract:
A semiconductor device can include a plurality of landing pads arranged according to a layout on a substrate, wherein a cross-sectional shape of each of the landing pads has a diamond shape so that opposing interior angles of the diamond shape are equal to one another and adjacent interior angles of the diamond shape are unequal to one another.
Public/Granted literature
- US20190386009A1 SEMICONDUCTOR DEVICES HAVING CONTACT PLUGS OVERLAPPING ASSOCIATED BITLINE STRUCTURES AND CONTACT HOLES Public/Granted day:2019-12-19
Information query
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