- 专利标题: Two dimension material fin sidewall
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申请号: US16052526申请日: 2018-08-01
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公开(公告)号: US10559564B2公开(公告)日: 2020-02-11
- 发明人: Sami Rosenblatt , Rasit O. Topaloglu
- 申请人: International Business Machines Corporation
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: ZIP Group PLLC
- 主分类号: H01L27/088
- IPC分类号: H01L27/088 ; H01L21/8234 ; H01L29/16 ; H01L29/51 ; H01L29/165 ; H01L21/762 ; H01L29/06 ; H01L21/02 ; H01L21/82 ; H01L21/8238 ; H01L21/3105
摘要:
A semiconductor structure includes fins that have a 2D material, such as Graphene, upon at least the fin sidewalls. The thickness of the 2D material sidewall may be tuned to achieve desired finFET band gap control. Neighboring fins of the semiconductor structure form fin wells. The semiconductor structure may include a fin cap upon each fin and the 2D material is formed upon the sidewalls of the fin and the bottom surface of the fin wells. The semiconductor structure may include a well-plug at the bottom of the fin wells and the 2D material is formed upon the sidewalls and upper surface of the fins. The semiconductor structure may include both fin caps and well-plugs such that the 2D material is formed only upon the sidewalls of the fins.
公开/授权文献
- US20180342511A1 Two Dimension Material Fin Sidewall 公开/授权日:2018-11-29
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