- 专利标题： System for manufacturing a semiconductor device
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申请号： US16149572申请日： 2018-10-02
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公开(公告)号： US10540475B2公开(公告)日： 2020-01-21
- 发明人: Chi-Wen Chang , Hui Yu Lee , Ya Yun Liu , Jui-Feng Kuan , Yi-Kan Cheng
- 申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 申请人地址： TW Hsinchu
- 专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址： TW Hsinchu
- 代理机构： Hauptman Ham, LLP
- 主分类号： G06F9/455
- IPC分类号： G06F9/455 ; G06F17/50
摘要：
A system including a memory; and a simulation tool connected to the memory. The simulation tool is configured to receive information related to a plurality of dies. The simulation tool is further configured to receive a plurality of input vectors. The simulation tool is further configured to determining a temperature profile for a first die of the plurality of dies. The simulation tool is further configured to simulate operation of a second die of the plurality of dies based on the determined temperature profile and the received plurality of input vectors.
公开/授权文献
- US20190034578A1 SYSTEM FOR MANUFACTURING A SEMICONDUCTOR DEVICE 公开/授权日：2019-01-31
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