Display panel, manufacturing method thereof and display device
摘要:
Provided are a display panel, a manufacturing method thereof and a display device. The display panel includes: a first substrate and a second substrate disposed opposite to each other, and a plurality of light-emitting units and a plurality of fingerprint identification units, disposed on one side of the first substrate facing to the second substrate. Each of the plurality of light-emitting units includes a first N-type semiconductor layer and a first P-type semiconductor layer, each of the plurality of fingerprint identification units includes a second N-type semiconductor layer and a second P-type semiconductor layer. The first N-type semiconductor layer and the second N-type semiconductor layer are disposed in a same layer, and the first P-type semiconductor layer and the second P-type semiconductor layer are disposed in a same layer.
信息查询
IPC分类:
H 电学
H01 基本电气元件
H01L 半导体器件;其他类目中不包括的电固体器件(使用半导体器件的测量入G01;一般电阻器入H01C;磁体、电感器、变压器入H01F;一般电容器入H01G;电解型器件入H01G9/00;电池组、蓄电池入H01M;波导管、谐振器或波导型线路入H01P;线路连接器、汇流器入H01R;受激发射器件入H01S;机电谐振器入H03H;扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R;一般电光源入H05B;印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K;在具有特殊应用的电路中使用的半导体器件见应用相关的小类)
H01L31/00 对红外辐射、光、较短波长的电磁辐射,或微粒辐射敏感的,并且专门适用于把这样的辐射能转换为电能的,或者专门适用于通过这样的辐射进行电能控制的半导体器件;专门适用于制造或处理这些半导体器件或其部件的方法或设备;其零部件(H01L51/42优先;由形成在一共用衬底内或其上的多个固态组件,而不是辐射敏感元件与一个或多个电光源的结合所组成的器件入H01L27/00)
H01L31/12 .与如在一个共用衬底内或其上形成的,一个或多个电光源,如场致发光光源在结构上相连的,并与其电光源在电气上或光学上相耦合的(场致发光光源本身入H05B33/00)
H01L31/16 ..由单光源或多光源控制的对辐射敏感的半导体器件
H01L31/167 ...对辐射敏感的光源或器件,均为以至少一个势垒或面垒为特征的半导体器件
H01L31/173 ....在一个公共衬底之内或之上形成的
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