- 专利标题: Semiconductor device and manufacturing method thereof
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申请号: US15729987申请日: 2017-10-11
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公开(公告)号: US10510752B2公开(公告)日: 2019-12-17
- 发明人: Che-Cheng Chang , Chih-Han Lin
- 申请人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
- 申请人地址: TW Hsin-chu
- 专利权人: Taiwan Semiconductor Manufacturing Company Limited
- 当前专利权人: Taiwan Semiconductor Manufacturing Company Limited
- 当前专利权人地址: TW Hsin-chu
- 代理机构: Cooper Legal Group, LLC
- 主分类号: H01L29/06
- IPC分类号: H01L29/06 ; H01L29/08 ; H01L29/66 ; H01L29/78 ; H01L21/306 ; H01L27/088 ; H01L29/423
摘要:
A semiconductor device includes at least one semiconductor fin, a gate electrode, at least one gate spacer, and a gate dielectric. The semiconductor fin includes at least one recessed portion and at least one channel portion. The gate electrode is present on at least the channel portion of the semiconductor fin. The gate spacer is present on at least one sidewall of the gate electrode. The gate dielectric is present at least between the channel portion of the semiconductor fin and the gate electrode. The gate dielectric extends farther than at least one end surface of the channel portion of the semiconductor fin.
公开/授权文献
- US20180053762A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 公开/授权日:2018-02-22
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