- 专利标题： Fan out package structure and method of manufacturing the same
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申请号： US15706783申请日： 2017-09-18
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公开(公告)号： US10510631B2公开(公告)日： 2019-12-17
- 发明人: Chih-Hsuan Tai , Chih-Hua Chen , Hao-Yi Tsai , Yu-Chih Huang , Chia-Hung Liu , Ting-Ting Kuo
- 申请人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 申请人地址： TW Hsinchu
- 专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址： TW Hsinchu
- 代理机构： JCIPRNET
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; H01L23/532 ; H01L23/522 ; H01L21/78 ; H01L25/065 ; H01L23/31 ; H01L21/66 ; H01L23/00
摘要：
A package structure and a method of manufacturing the same are provided. The package structure includes a die, a redistribution layer (RDL) structure, a through integrated fan-out via (TIV) and a first connector. The RDL structure is connected to the die and includes a plurality of RDLs. The TIV is aside the die and penetrates through the RDL structure. The first connector is in electrical contact with the TIV and electrically connected to the die. The TIV is in electrical contact with the RDLs of the RDL structure.
公开/授权文献
- US20190088564A1 PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME 公开/授权日：2019-03-21
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