Invention Grant
- Patent Title: Sensor and sensor package
-
Application No.: US15445748Application Date: 2017-02-28
-
Publication No.: US10473685B2Publication Date: 2019-11-12
- Inventor: Yoshihiko Fuji , Michiko Hara , Kei Masunishi , Yoshihiro Higashi , Shiori Kaji , Akiko Yuzawa , Tomohiko Nagata , Kenji Otsu , Kazuaki Okamoto , Shotaro Baba
- Applicant: KABUSHIKI KAISHA TOSHIBA
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2016-184197 20160921
- Main IPC: G01C19/5607
- IPC: G01C19/5607 ; G01P15/09 ; G01P15/105 ; G01P3/44

Abstract:
According to one embodiment, a sensor includes a first support portion, a first movable portion, a first piezoelectric element, and a first magnetic element. The first movable portion extends in a first extension direction and is connected to the first support portion. The first piezoelectric element is fixed to the first movable portion. The first piezoelectric element includes a first electrode, a second electrode provided between the first electrode and the first movable portion, and a first piezoelectric layer provided between the first electrode and the second electrode. The first magnetic element is fixed to the first movable portion. The first magnetic element includes a first magnetic layer, a second magnetic layer, and a first intermediate layer provided between the first magnetic layer and the second magnetic layer.
Public/Granted literature
- US20180080953A1 SENSOR AND SENSOR PACKAGE Public/Granted day:2018-03-22
Information query