- 专利标题: Semiconductor device, manufacturing method therefor and semiconductor module
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申请号: US15536353申请日: 2015-01-13
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公开(公告)号: US10438947B2公开(公告)日: 2019-10-08
- 发明人: Kazuhiro Nishimura , Makoto Ueno , Masataka Mametuka
- 申请人: Mitsubishi Electric Corporation
- 申请人地址: JP Tokyo
- 专利权人: Mitsubishi Electric Corporation
- 当前专利权人: Mitsubishi Electric Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Studebaker & Brackett PC
- 国际申请: PCT/JP2015/050641 WO 20150113
- 国际公布: WO2016/113841 WO 20160721
- 主分类号: H01L27/06
- IPC分类号: H01L27/06 ; H01L29/739 ; H01L29/74 ; H01L21/8222 ; H01L29/06 ; H01L29/66 ; H01L27/07 ; H01L23/52 ; H01L27/092
摘要:
A semiconductor device of the present invention achieves improved avoidance of a parasitic operation in a circuit region while achieving miniaturization of the semiconductor device and a reduction in the amount of time for manufacturing the semiconductor device. The semiconductor device according to the present invention includes an IGBT disposed on a first main surface of a semiconductor substrate provided with a drift layer of a first conductivity type; a thyristor disposed on the first main surface of the semiconductor substrate; a circuit region; a hole-current retrieval region separating the IGBT and the circuit region in a plan view; and a diffusion layer of a second conductivity type, the diffusion layer being disposed on a second main surface of the semiconductor substrate. The IGBT has an effective area equal to or less than an effective area of the thyristor in a plan view.
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