- 专利标题： Electronic module comprising a plurality of encapsulation layers and a method for producing it
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申请号： US14876624申请日： 2015-10-06
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公开(公告)号： US10418313B2公开(公告)日： 2019-09-17
- 发明人: Edward Fuergut , Martin Gruber , Juergen Hoegerl
- 申请人： Infineon Technologies Austria AG
- 申请人地址： AT Villach
- 专利权人： Infineon Technologies Austria AG
- 当前专利权人： Infineon Technologies Austria AG
- 当前专利权人地址： AT Villach
- 代理机构： Murphy, Bilak & Homiller, PLLC
- 优先权： DE102014114520 20141007
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L23/31 ; H01L21/56 ; H01L23/538 ; H01L23/00 ; H01L21/48 ; H01L23/433
摘要：
An electronic module includes a first insulation layer, at least one carrier having a first main surface, a second main surface situated opposite the first main surface, and side surfaces connecting the first and second main surfaces to one another, at least one semiconductor chip arranged on the second main surface of the carrier, wherein the semiconductor chip has contact elements, and a second insulation layer, which is arranged on the carrier and the semiconductor chip.
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