Invention Grant
- Patent Title: Semiconductor devices and methods for manufacturing the same
-
Application No.: US15821230Application Date: 2017-11-22
-
Publication No.: US10366997B2Publication Date: 2019-07-30
- Inventor: Changseop Yoon
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel, P.A.
- Priority: KR10-2015-0046293 20150401
- Main IPC: H01L27/11
- IPC: H01L27/11

Abstract:
A semiconductor device includes a substrate including first and second active patterns thereon, a first gate electrode intersecting the first and second active patterns, first and second source/drain regions on the first and second active patterns, respectively, at one side of the first gate electrode, and an active contact on the first source/drain region so as to be electrically connected to the first source/drain region. The active contact includes a first sub-contact and a second sub-contact. The second sub-contact includes a vertical extension vertically extending toward the substrate. A bottom surface of the vertical extension is lower than a bottom surface of the first sub-contact.
Public/Granted literature
- US20180108663A1 SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING THE SAME Public/Granted day:2018-04-19
Information query
IPC分类: