Invention Grant
- Patent Title: Integrated circuit element and fabricating method thereof, circuit board, display panel and display device
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Application No.: US15662896Application Date: 2017-07-28
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Publication No.: US10340145B2Publication Date: 2019-07-02
- Inventor: Yuzhen Guo , Xue Dong , Haisheng Wang , Chunwei Wu , Yingming Liu , Xiaoliang Ding , Rui Xu , Changfeng Li , Lijun Zhao , Yanling Han , Pengpeng Wang , Xueyou Cao , Ping Zhang , Wei Liu , Yanan Jia
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Brooks Kushman P.C.
- Priority: CN201610617929 20160729
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H01L23/00 ; H01L21/28 ; G01R1/04 ; H01L21/31 ; H01L23/32 ; H05K1/14 ; G02F1/1345

Abstract:
An integrated circuit element and a fabrication method thereof, a circuit board, a display panel and a display device are provided, to reduce space occupied by the integrated circuit element and facilitate achieving intelligent transparent display by arranging the integrated circuit element in a display. The integrated circuit element includes a base plate, and a bare integrated circuit chip and multiple connection parts arranged on the base plate. The bare integrated circuit chip includes multiple connection points that are respectively electrically connected to the multiple connection parts.
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