Invention Grant
- Patent Title: Machining features in a ceramic component for use in an electronic device
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Application No.: US14868560Application Date: 2015-09-29
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Publication No.: US10335979B2Publication Date: 2019-07-02
- Inventor: Naoto Matsuyuki , Adam T. Clavelle , Inori Iwata , David I. Nazzaro
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: APPLE INC.
- Current Assignee: APPLE INC.
- Current Assignee Address: US CA Cupertino
- Agency: Dorsey & Whitney LLP
- Main IPC: B28B1/14
- IPC: B28B1/14 ; B28B1/24 ; B28B1/48 ; C04B35/48 ; B28B11/24 ; B28B11/12 ; H05K5/00 ; B28D1/14 ; B28B11/08 ; H04M1/02
Abstract:
A ceramic part and methods for making the ceramic part are disclosed. A green body or non-sintered part may be formed using a casting or molding process. The green body may not be sintered or may be partially sintered before machining one or more features into a surface of the green body. After machining, the component may be fully sintered to create a hardened ceramic component.
Public/Granted literature
- US20160089811A1 MACHINING FEATURES IN A CERAMIC COMPONENT FOR USE IN AN ELECTRONIC DEVICE Public/Granted day:2016-03-31
Information query
