- Patent Title: Compound semiconductor device and method of manufacturing the same
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Application No.: US15619679Application Date: 2017-06-12
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Publication No.: US10276703B2Publication Date: 2019-04-30
- Inventor: Youichi Kamada , Shirou Ozaki
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Fujitsu Patent Center
- Priority: JP2016-137821 20160712
- Main IPC: H01L29/772
- IPC: H01L29/772 ; H01L29/778 ; H01L29/66 ; H01L23/29 ; H01L23/31 ; H01L29/423 ; H01L29/20

Abstract:
A compound semiconductor device includes: a carrier transit layer; a carrier supply layer over the carrier transit layer; a source electrode and a drain electrode above the carrier supply layer; a gate electrode above the carrier supply layer between the source electrode and the drain electrode; and a first insulating film and a second insulating film above the carrier supply layer between the gate electrode and the drain electrode. The gate electrode includes a portion above the second insulating film, the second insulating film covers a side surface of the first insulating film from the drain electrode side, and a second concentration of electron traps in the second insulating film is higher than a first concentration of electron traps in the first insulating film.
Public/Granted literature
- US20180019333A1 COMPOUND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2018-01-18
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