Invention Grant
- Patent Title: Substrate processing system, substrate cleaning method, and recording medium
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Application No.: US14809387Application Date: 2015-07-27
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Publication No.: US10272478B2Publication Date: 2019-04-30
- Inventor: Meitoku Aibara , Yuki Yoshida , Hisashi Kawano , Masami Yamashita , Itaru Kanno , Kenji Mochida , Motoyuki Shima
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Minato-Ku
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Minato-Ku
- Agency: Burr & Brown, PLLC
- Priority: JP2014-157196 20140731; JP2015-092918 20150430
- Main IPC: B08B3/08
- IPC: B08B3/08 ; H01L21/02 ; H01L21/67
Abstract:
An object of the present invention is to obtain a high removing performance of particles. The substrate processing system according to the exemplary embodiment includes a holding unit and a removing solution supply unit. The holding unit holds a substrate that has a treatment film formed thereon, the treatment film includes an organic solvent and a fluorine-containing polymer that is soluble in the organic solvent. The removing solution supply unit supplies to the treatment film formed on the substrate, a removing solution capable of removing the treatment film.
Public/Granted literature
- US20160035561A1 SUBSTRATE PROCESSING SYSTEM, SUBSTRATE CLEANING METHOD, AND RECORDING MEDIUM Public/Granted day:2016-02-04
Information query
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