Invention Grant
- Patent Title: Dielectric waveguide bundle including a supporting feature for connecting first and second server boards
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Application No.: US15282086Application Date: 2016-09-30
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Publication No.: US10249925B2Publication Date: 2019-04-02
- Inventor: Georgios C. Dogiamis , Sasha N. Oster , Telesphor Kamgaing , Adel A. Elsherbini , Johanna M. Swan , Shawna M. Liff , Aleksandar Aleksov , Brandon M. Rawlings , Richard J. Dischler
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01P3/12
- IPC: H01P3/12 ; H01P3/14 ; H01P11/00 ; G06F1/18 ; H01P3/16
Abstract:
An apparatus comprises a plurality of waveguides, wherein the waveguides include a dielectric material; an outer shell; and a supporting feature within the outer shell, wherein the waveguides are arranged separate from each other within the outer shell by the supporting feature.
Public/Granted literature
- US20180097269A1 WAVEGUIDE BUNDLE FABRICATION IN SUSPENDED MEDIA TARGETING BEND-INDUCED STRAIN RELIEF Public/Granted day:2018-04-05
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