- 专利标题： Semiconductor module and manufacturing method of semiconductor module
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申请号： US15418787申请日： 2017-01-30
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公开(公告)号： US10128167B2公开(公告)日： 2018-11-13
- 发明人: Akira Morozumi , Hiromichi Gohara , Yoshitaka Nishimura
- 申请人： FUJI ELECTRIC CO., LTD.
- 申请人地址： JP Kanagawa
- 专利权人： FUJI ELECTRIC CO., LTD.
- 当前专利权人： FUJI ELECTRIC CO., LTD.
- 当前专利权人地址： JP Kanagawa
- 优先权： JP2016-051070 20160315
- 主分类号： H01L23/473
- IPC分类号： H01L23/473 ; H01L21/50 ; H01L23/053 ; H01L23/40 ; H01L23/42 ; H01L25/11
摘要：
A semiconductor module is provided, including: a cooling-target device; a first cooling unit on which the cooling-target device is placed and that has a flow channel through which a refrigerant for cooling the cooling-target device flows; and a second cooling unit to which the first cooling unit is fixed and that has a flow channel coupled with the flow channel of the first cooling unit. Also, a semiconductor module manufacturing method is provided, including: placing a cooling-target device on a first cooling unit that has a flow channel through which a refrigerant for cooling the cooling-target device flows; and fixing the first cooling unit to a second cooling unit that has a flow channel coupled with the flow channel of the first cooling unit.
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