- 专利标题: Memory device and method for manufacturing the same
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申请号: US15017899申请日: 2016-02-08
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公开(公告)号: US10074694B2公开(公告)日: 2018-09-11
- 发明人: Takeshi Takagi , Takeshi Yamaguchi , Masaki Yamato , Hiroyuki Ode , Toshiharu Tanaka
- 申请人: Toshiba Memory Corporation
- 申请人地址: JP Minato-ku
- 专利权人: TOSHIBA MEMORY CORPORATION
- 当前专利权人: TOSHIBA MEMORY CORPORATION
- 当前专利权人地址: JP Minato-ku
- 代理机构: Oblon, McClelland, Maier & Neustadt, L.L.P.
- 主分类号: H01L27/24
- IPC分类号: H01L27/24 ; H01L45/00 ; G11C13/00
摘要:
According to one embodiment, a memory device includes a first wiring extending in a first direction, a second wiring extending in a second direction crossing the first direction and a resistance change film provided between the first wiring and the second wiring. The second wiring includes a first conductive layer and a first intermediate layer including a first region provided between the first conductive layer and the resistance change film. The first intermediate layer includes a material having nonlinear resistance characteristics.
公开/授权文献
- US20170025475A1 MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME 公开/授权日:2017-01-26
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