- 专利标题： Packaging substrate and electronic package having the same
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申请号： US15063592申请日： 2016-03-08
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公开(公告)号： US10062651B2公开(公告)日： 2018-08-28
- 发明人: Fang-Yu Liang , Hung-Hsien Chang , Yi-Che Lai , Chang-Fu Lin
- 申请人： Siliconware Precision Industries Co., Ltd.
- 申请人地址： TW Taichung
- 专利权人： Siliconware Precision Industries Co., Ltd.
- 当前专利权人： Siliconware Precision Industries Co., Ltd.
- 当前专利权人地址： TW Taichung
- 代理机构： Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- 代理商 Peter F. Corless; Steven M. Jensen
- 优先权： TW104144006A 20151228
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L23/31 ; H01L23/522 ; H01L23/16 ; H01L21/48 ; H01L23/14 ; H01L23/15 ; H01L23/498
摘要：
A packaging substrate is provided, which includes: a substrate body having a first region with a plurality of conductive pads and a second region adjacent to the first region, and a material layer formed on the second region to prevent the substrate body from warping. An electronic package having the packaging substrate is also provided.
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