- 专利标题: Forming transistor by selectively growing gate spacer
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申请号: US15491384申请日: 2017-04-19
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公开(公告)号: US10037923B1公开(公告)日: 2018-07-31
- 发明人: Kai-Hsuan Lee , Chia-Ta Yu , Cheng-Yu Yang , Sheng-Chen Wang , Bo-Yu Lai , Bo-Cyuan Lu , Chi On Chui , Sai-Hooi Yeong , Feng-Cheng Yang , Yen-Ming Chen
- 申请人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址: TW Hsinchu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Slater Matsil, LLP
- 主分类号: H01L21/8238
- IPC分类号: H01L21/8238 ; H01L27/092 ; H01L29/49 ; H01L29/08
摘要:
A method includes forming a gate dielectric layer on a semiconductor fin, and forming a gate electrode over the gate dielectric layer. The gate electrode extends on sidewalls and a top surface of the semiconductor fin. A gate spacer is selectively deposited on a sidewall of the gate electrode. An exposed portion of the gate dielectric layer is free from a same material for forming the gate spacer deposited thereon. The method further includes etching the gate dielectric layer using the gate spacer as an etching mask to expose a portion of the semiconductor fin, and forming an epitaxy semiconductor region based on the semiconductor fin.
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