The utility model relates to a packaging system for an electronic element, making it have compactness and good adhesion. A packaging device for ball lattice array integrated circuit comprises a base plate, a conductor layer, a depressed area and a globe. The base plate comprises an upper surface, a bottom face and a hole. The utility model is characterized in that The hole perforates from the upper surface to the bottom surface covered separately by the first and the second thin membranes and the conductor layer is placed in the hole to form an inner lining; The depressed area disposed on the second thin membrane is located under the hole and a shim is disposed in the hole; The globe is welded to the shim at the bottom of the depressed area and immerges in the depressed area of the second thin membrane. The model is used for packaging electronic elements.