The utility model provides a plane array does not have pin CSP packaging part, include a plurality of each other about separated the surface all with the end of drawing that has the nickel dam, the stack has the resin layer on the nickel dam to fill adjacent upper end cavity of drawing forth between the end, be equipped with a plurality of copper facing through -holes that communicate with the nickel dam on the resin layer, the copper facing through -hole communicates through the printing line, and it has the IC chip to paste, there is the plastic -sealed body on the resin layer. The copper alloy thin slice of nickel dam is plated to the sculpture, and a plurality of copper facing through -hole and many printing lines that feed through nickel dams are made to the resin layer that superposes on the copper alloy thin slice on the resin layer, paste the IC chip on the resin layer, and the plastic envelope makes the CSP packaging part. This CSP for the packaging part resin layer realized encapsulated circuit's rewiring through the printing line as middle supporting layer, be the end of drawing of wrapper spare plane array and distribute in the plastic -sealed body bottom, make the packaging part can hold more leading -out terminal in the unit erection space.