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发明授权
CN1971899B 封装基板 失效 - 权利终止

封装基板
摘要：
在封装基板中，在IC芯片一侧的表面(上面)上的焊接区小(直径为133～170μm)，焊接区的金属部分所占的比例小，另一方面，母板等一侧的表面(下面)上的焊接区大(直径为600μm)，金属部分的比例大。这里，在本封装基板中，在封装基板的IC芯片一侧的形成信号线的导体电路(58U、58U)之间形成虚拟图形(58M)，由此，封装基板的IC芯片的一侧的金属部分增加，从而调整该IC芯片一侧与母板一侧的金属部分的比例，使封装基板在制造工序和使用过程中不产生翘曲。
摘要（英）：

According to the package board of the present invention, each soldering pad formed on the top surface of the package board, on which an IC chip is to be mounted, is small (133 to 170 mum in diameter),so the metallic portion occupied by the soldering pads on the surface of the package board is also small. On the other hand, each soldering pad formed on the bottom surface of the package board, on which a mother board, etc. are to be mounted, is large (600 mum in diameter), so the metallic portion occupied by the soldering pads on the surface of the package board is also large. Consequently, a dummy pattern 58M is formed between conductor circuits 58U and 58U for forming signal lines on the IC chip side surface of the package board thereby to increase the metallic portion on the surface andadjust the rate of the metallic portion between the IC chip side and the mother board side of the package board, protecting the package board from warping in the manufacturing processes, as well as during operation.

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