An internal connection wire structure covered by metallic barrier layer features that there is an opening between two metal conductors, a metallic barrier layer is formed on the side wall of metal conductor, the exposed areas no metallic barrier layer and metal conductors are covered by dielectric layer which is filled in said opening, and a contact plug is used for electric connection between dielectric layer and metal conductors. Its advantage is high adhesion between internal connection wire structure and intrametal dielectric layer.