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发明公开
CN110783209A 一种数字隔离芯封装件的生产方法 有权

一种数字隔离芯封装件的生产方法
摘要：
本发明公开了一种数字隔离芯封装件的生产方法，属于微电子组装与封装领域，以解决现有方法封装的集成电路引脚、载体和塑封料的界面分层不能达到标准要求和封装良率低的问题。一种数字隔离芯封装件的生产方法，包括如下步骤：A、进行晶圆减薄和划片，形成引线框架；B、将芯片粘贴到引线框架的载体上；C、烘烤；D、烘烤后等离子清洗，E、压焊；F、塑封，再采用封装生产工艺进行打印、测试，接着进行切筋，一次成型,制得宽体小外形封装件。本发明提供的高效率生产方法可生产具有可靠性达到MSL3上的高压隔离功能的数字IC封装件。
摘要（英）：

The invention discloses a production method for a digital isolation core packaging part, which belong to the field of microelectronic assembly and packaging and aims to solve the problems that the interface layering of pins, carriers and plastic packaging materials of an integrated circuit packaged by an existing method cannot meet the standard requirement and the packaging yield is low. The production method for the digital isolation core packaging piece comprises the following steps of: A, thinning and scribing a wafer to form a lead frame, B, adhering a chip to a carrier of the lead frame,C, baking, D, conducting plasma cleaning after baking, E, conducting pressure welding, and F, performing plastic packaging, printing and testing by adopting a packaging production process, and then performing rib cutting and one-step molding to obtain the wide-body small-shape packaging piece. The high-efficiency production method provided by the invention can be used for producing a digital IC packaging piece with the reliability reaching the high-voltage isolation function on the MSL3.

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