The invention discloses a method for connecting an electronic material and a hydrogel substrate. According to the invention, a conductive polymer adhesive layer is polymerized on the surfaces of a conductive or semiconductor grid structure and a porous material (such as hydrogel) in situ, the operation is simple, and the adhesive capacity between the conductive or semiconductor grid structure andthe porous material can be remarkably improved, the conductive polymer adhesive layer only polymerizes on the surface of the grid structure, by controlling the polymerization time and polymerization amount, the PEDOT does not cover the surface of the whole substrate material, so that the porous characteristic of the conductive or semiconductor grid structure and the water and oxygen permeation characteristic of the hydrogel substrate are reserved to the maximum extent, and the light transmission performance of the original material is not seriously influenced.