The invention provides a manufacturing method of a soft-hard bonding board, which relates to the technical field of circuit boards. The method is realized by two punching, two laminating, pure copperfoil and thermosetting glue protection, which solves the penetration of the medicinal liquid and improves the risk of nick at the soft and hard junction. Although it belongs to one of the uncovering methods, compared with the traditional uncovering method, the manufacturing method of the mould has lower difficulty and lower cost.