A honeycomb-type heating device 1 is equipped with: a columnar honeycomb substrate 2 that has partitions 4 for delimiting and forming a plurality of cells 5, and an outer-circumferential wall 3 surrounding the partitions 4; a plurality of heaters 9 adjacently arranged on the outer-circumferential surface 8 of the outer-circumferential wall 3 in the circumferential direction thereof; a connecting body 11 that electrically connects the plurality of heaters 9, and is arranged in the circumferential direction of the outer-circumferential surface 8; and a metal case for housing the honeycomb substrate 2, the plurality of heaters 9, and the connecting body 11. Therein, the heaters are of the resistance heating type, the cross-sectional surface area of a connecting-body 11 cross-section that is perpendicular to the circumferential direction of the outer-circumferential surface 8 is 10.0-30.0mm<2>, and the thermal expansion coefficient of the connecting body 11 is greater than the thermal expansion coefficient of the honeycomb substrate 2 by 3.0*10<-6>/DEG C or more.