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发明授权
CN108428694B 一种系统级封装芯片及其封装方法 有权

一种系统级封装芯片及其封装方法
摘要：
本发明公开了一种系统级封装SiP芯片，所述SiP芯片包括：封装基板及位于所述封装基板上的一个第一芯片及至少一个第二芯片；其中，第一芯片及所述至少一个第二芯片分别采用倒装键合的方式与封装基板相连；第一芯片上设置有凹形倒扣接口，第二芯片上设置有凸形倒扣接口，或者，第一芯片上设置有凸形倒扣接口，第二芯片上设置有凹形倒扣接口；第一芯片与所述至少一个第二芯片通过凹形倒扣接口及凸形倒扣接口相连。
摘要（英）：

The invention discloses a system-level packaging SiP chip, comprising a packaging substrate, a first chip and at least one second chip which are disposed on the packaging substrate. The first chip andthe at least one second chip are respectively connected to the packaging substrate through back bonding. The first chip is provided with a concave inversely-buckled interface, and the second chip isprovided with a convex inversely-buckled interface. Or the first chip is provided with the convex inversely-buckled interface, while the second chip is provided with the concave inversely-buckled interface. The first chip and the at least one second chip are connected through the concave inversely-buckled interface and the convex inversely-buckled interface.

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